Copper-based Solder Paste - PCuSnNi
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Copper Phosphorus Brazing Filler Solder
As the main components of Cu-P binary alloy, the copper phosphorus
brazing filler solder is mainly used for brazing of copper and copper
alloy, which could replace the silver brazing alloy in many applications.
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Copper Phosphorus Silver Brazing Filler Solder
Hiwave adds silver on the Cu-P binary alloy, and make it to be the
brazing filler metal made by Copper, Phosphorus and silver. This
combination has a great effect on reducing the melting temperature,
optimizing the technological performance, and improve the tensile
strength and plasticity of joints.
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Bronze Brazing Filler Solder
Hiwave puts Phosphorus and small amount of functional elements into
the Cu-Sn binary alloy, which is Used for brazing carbon steel with
stainless steel, carbon steel with red copper and stainless steel with
red copper.
Below are the series that Hiwave provides: