top of page
Hiwave Cu-based solder paste
Copper-based Solder Paste - PCuSnNi
  • Copper Phosphorus Brazing Filler Solder

        As the main components of Cu-P binary alloy, the copper phosphorus

        brazing filler solder is mainly used for brazing of copper and copper

        alloy, which could replace the silver brazing alloy in many applications. 

  • Copper Phosphorus Silver Brazing Filler Solder

        Hiwave adds silver on the Cu-P binary alloy, and make it to be the

        brazing filler metal made by Copper, Phosphorus and silver. This

        combination has a great effect on reducing the melting temperature,

        optimizing the technological performance, and improve the tensile

         strength and plasticity of joints. 

  • Bronze Brazing Filler Solder

        Hiwave puts Phosphorus and small amount of functional elements into

        the Cu-Sn binary alloy, which is Used for brazing carbon steel with

        stainless steel, carbon steel with red copper and stainless steel with

        red copper.
 

Below are the series that Hiwave provides:

Hiwave cu-based solder paste
bottom of page