Multifunctional Roundness
Measuring Instrument
Non-contact
Inductive Micrometer
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Classic Model
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Apply to Semiconductor, IC (Integrated Circuits), IGBT modules, Low-voltage electrical appliances, Diamond tools industries.
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Large-scale Model
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Apply to Vacuum brazing (water-cooled cooling panel), carbon fiber composite materials, large welding sub-assembly of low-voltage electrical apparatus.
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High-speed
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Complete inspection
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Apply to Semiconductor, IC (Integrated Circuits), Diamond tools industries.
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Desk-top Model
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Apply to Semiconductor, IC (Integrated Circuits), Low-voltage electrical appliances industries.
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Silver/Graphene (AgGr)
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Copper/Graphene (CuGr)
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Cu/Mo/Cu Packaging Material
Applications:
Microwave, communication
equipment, radio frequency device,
aerospace, power electronics,
high-power semiconductor laser,
medical supplies, etc.
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Cu/C Material
Applications:
Electrical contact, mechanical parts,
anti-friction material
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Widely used in low-voltage electrical appliances, air conditioning & refrigeration, automotive, aviation, ships and other industries.
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Silver Copper Zinc - BAgCuZn
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Silver Copper Phosphor - BCuPAg
Silver-Free Low Temp
Solder Paste
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Includes copper solder paste, bronze copper solder paste, brass copper solder paste, copper phosphor solder paste.
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The composition, viscosity and volatility of could be adjusted to fulfill different demands.
Copper-Based Solder Paste
(PCuSnNi)
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Copper Phosphorus Brazing Filler Solder
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Copper Phosphorus Silver Brazing Filler Solder
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Bronze Brazing Filler Solder