As electronic systems become smaller, much more powerful and efficient, the performance is increasingly emphasized on.  Therefore, thermal challenge has become the key factor in electronic packaging design.
 

The purpose of thermal management, is to effectively dissipate

heat from the semiconductor junction to the surrounding environment. It could be effectively avoid the harmful effects on semiconductor's efficiency and reliability, which caused by the insufficient heat conduction and dissipation. 

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For most of the electronic components losing function, is due to 

overheating operating temperatures, or mechanical stresses caused by different temperature differences.

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• Cooper/Molybdenum/Cooper Packaging Material (Cu/Mo/Cu)

         - Three layers structure of flat composite material; Pure molybdenum

            as the core material, and coated with pure copper or dispersion

            reinforced copper on both sides

         - Excellent performance on electrical conductivity, and with adjustable

            coefficient of thermal expansion

         - Can be used with Be0 and ceramics Al203

         - The preferred material used in high power electronic components in

            the domestics and overseas

         - Applications: 

            Microwave, communication equipment, radio frequency device,

            aerospace, power electronics, high-power semiconductor laser,

            medical supplies and other industries

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• Cooper/Graphite (Cu/C)

         ​- With good performance on contact lubricity, electric and thermal

            conductivity; Low coefficient of thermal expansion; Resistance to

            welding, abrasion and arc ablation

         - Applications:

            Electrical contact, mechanical parts, and anti-friction material

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