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Sliver-Graphene (AgGr)
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Copper-Graphene (CuGr)
With good conductivity, low
and stable contact resistance,
excellent performance in low-
temperature rise and arc
mobility and welding
resistance.
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Cu/Mo/Cu Packaging Material
Applications:
Microwave, communication
equipment, radio frequency device,
aerospace, power electronics,
high-power semiconductor laser,
medical supplies, etc.
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Cu/C Material
Applications:
Electrical contact, mechanical parts,
anti-friction material
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Widely used in low-voltage electrical appliances, air conditioning & refrigeration, automotive, aviation, ships and other industries.
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Silver Copper Zinc - BAgCuZn
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Silver Copper Phosphor - BCuPAg
Silver-Free Low Temp
Solder Paste
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Includes copper solder paste, bronze copper solder paste, brass copper solder paste, copper phosphor solder paste.
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The composition, viscosity and volatility of could be adjusted to fulfill different demands.
Copper-Based Solder Paste
(PCuSnNi)
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Copper Phosphorus Brazing Filler Solder
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Copper Phosphorus Silver Brazing Filler Solder
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Bronze Brazing Filler Solder